Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Product code: UR5083RP500G - UR5083RP250G - UR5083K5K - UR5083K1K - UR5083B5K - UR5083AB5K
UR5083 is a very high performance resin system that has the unique ability to "self heal" if penetrated. This makes a good choice for applications such as cabling and wiring where connectors or components require passing through the resin itself after application. Another benefit of this is that testing can also be done through the resin itself.
The resin adheres to the case or electronic device, while sliding off the test probe, wire or connector as it is removed, closing the up behind as it is removed and providing a barrier to moisture. These properties make it ideal for electronics encapsulation for marine applications or submerged units such as underwater cabling.
Its long useable life also makes it a good choice for potting complex PCB geometry.
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