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Encapsulation Resins

Meeting the challenge of challenging environments

  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins


SC4010 - Low Viscosity Silicone

Low Viscosity Silicone

250g - 25Kg

Product code: SC4010RP250G - SC4010K25K

SC4010 is a low viscosity, fast curing, two-part silicone potting and encapsulating resin designed for the Indian market. It has been primarily developed for the protection of LED Drivers but its properties make it suited for a wide range of applications. It has excellent high temperature properties, suitable for use in applications where the operating temperature may rise to 200°C while its flexibility allows for temperature cycling. Low viscosity and good flow characteristics make this an excellent choice for extremely tight spaces or difficult geometries.

Key Properties:
  • Flexible Silicone Resin
  • Low viscosity
  • Fast curing
  • Room temperature cure, no ovens required
  • Excellent Moisture resistance
  • Wide temperature range (-60°C to +200°C)
  • Good thermal conductivity(1.0 W/m.K)
  • Excellent adhesion to a wide range of substrates
  • White Silicone Resin
  • RoHS Compliant

Product data sheets
SC4010 (tds) Download

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