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Encapsulation Resins

Meeting the challenge of challenging environments

  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins


SC4004 - Thixotropic Silicone Resin

Thixotropic Silicone Resin

250g - 5kg - 10kg - 20Kg

Product code: SC4004RP250G - SC4004K5K - SC4004K10K - SC4004K20K

SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market. Due to its thixotropic nature it has good flow characteristics to aid the potting of tight units or electronics containing small and delicate components. It has good thermal conductivity and dissipates heat away from components whilst maintaining performance over a wide operating temperature range.

Key Properties:
  • Thixotropic with good flow characteristics
  • Flexible Silicone Resin
  • Excellent Moisture resistance
  • Wide temperature range (-60°C to +200°C)
  • High thermal conductivity(1.0 W/m.K)
  • Simple 1:1 mix ratio,
  • Excellent adhesion to a wide range of substrates
  • Grey Silicone Resin
  • RoHS Compliant

Product data sheets
SC4004 (tds) Download

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