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Encapsulation Resins

Meeting the challenge of challenging environments

  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins


SC4001 - Thermally Conductive Silicone

Thermally Conductive Silicone

250g - 5kg - 10kg - 20Kg

Product code: SC4001RP250G - SC4001K5K - SC4001K10K - SC4001K20K

SC4001 is a thermally conductive silicone potting compound resin. It has been developed for the encapsulation or potting of delicate electronic components that require protection from the environment while dissipating heat away from the unit. As it is a silicone it is a flexible resin making it a good choice for more delicate components or for units that will undergo thermal cycling over a wide temperature range. Developed specially for the Indian market it can cure even in humid environments.

Key Properties:
  • Flexible Silicone Resin
  • Excellent Moisture resistance
  • Thermally conductive 0.7 (W/m.K)
  • Wide operating temperature range (-50°C to +200°C)
  • Excellent high temperature performance
  • Able to withstand thermal shock cycling
  • Good thermal conductivity
  • Excellent adhesion to a wide range of substrates
  • Grey Silicone Resin
  • RoHS Compliant

Product data sheets
SC4001 (tds) Download

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