Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Product code: ER6003RP250G - ER6003K25K
Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent. The Resin offers good protection against a wide range of environments as well as offering chemical resistance for harsher conditions and a wide operating temperature range.
ER6003 is a thermally conductive resin offering 1.0 (W/m.K) dissipating heat from the driver unit to the outer casing. ER6003 has good flow characteristics, allowing even tight units to be potted.
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