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Encapsulation Resins

Meeting the challenge of challenging environments

  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER6001  - High Temperature Epoxy Resin

ER6001
High Temperature Epoxy Resin

250g - 5kg - 25kg

Product code: ER6001RP250G - ER6001K5K - ER6001K25K


ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good chemical resistance and a wide operating temperature range, performing exceptionally at high temperatures. ER6001 is suitable for a wide variety of applications within the electronics industry such as the automotive industry or industrial controls.


Key Properties:
  • Good bond strength
  • Good chemical resistance;
  • Excellent adhesion to a wide range of substrates
  • Wide operating temperature range (-40°C to +150°C)
  • Can operate short term (30min bursts) up to 180°C
  • Black epoxy resin
  • RoHS Compliant

Product data sheets
ER6001 (tds) Download

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