Meeting the challenge of challenging environments
Electrolube epoxy resins are specialist systems for potting and encapsulating printed circuit boards (PCBs) and electronic components. Resin systems are designed to protect the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals or physical shock and vibrations.More info > Download product selector chart > Download product brochure >
Formulated to exhibit excellent electrical and physical properties, Electrolube epoxy resin systems are created in order to protect the electronic device allowing it to operate in some of the harshest conditions, while in the process maintaining and enhancing performance.
Epoxy resins are generally much harder compounds than the other resin chemistries, once cured they offer superb mechanical and chemical protection. This makes them an ideal choice for some of the toughest applications such as the automotive, aerospace and marine industries.
Electrolube epoxy resins also exhibit excellent thermal properties, dissipating heat away from components
For More details on the Chemistry of Epoxy resins, have a look at our knowledge centre articles below:
Highly adhesive epoxy resin for adhesion or encapsulation.
Very low viscosity epoxy resin with excellent clarity.
Fast curing, low viscosity resin which is tough once cured.
Two-part epoxy resin - flame retardant with excellent solvent resistance.
Medium viscosity, thermally conductive and flame retardant, two part encapsulating and potting compound
General purpose two part epoxy resin, flame retardant, encapsulating and potting compound
General purpose two part encapsulating and potting compound with high toughness.
Very low viscosity flame retardant resin two part potting and encapsulating compound
One-part epoxy resin suitable for dipping and glob-top
Highly thermally conductive epoxy, flame retardant, two part encapsulation compound
highly temperature resistant and thermally conductive potting compound
Specialist red epoxy potting compound for the electronics industry
ER2223 black epoxy resin has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry.
ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties.
Specialist epoxy potting compound for automotive industry electronics
High temperature resistant, thermally conductive, two-part encapsulation compound based on epoxy technology
ER4002 is an ideal choice for automotive potting and encapsulation applications
two-part epoxy adhesive / encapsulation resin for the encapsulation of electrical components
ER6002LV epoxy potting compound has been specially developed for the LED Industry in India
ER6003 epoxy potting compound has been specially developed for the LED Industry in India
Thermally conductive epoxy potting compound ideal for LEDs
Unique Epoxy potting compound / encapsulation resin for electronics protection
ER6007 is a two-part epoxy potting compound / encapsulating resin designed for the protection of electronic devices or components.
A flame retardant, thermally conductive resin with a wide operating temperature range and excellent water resistance.