Compare Encapsulation Resins Products
| ER1122 Adhesive Epoxy Resin   |  | ER1122 Adhesive Epoxy Resin   | ER1122 Adhesive Epoxy Resin   | |
|---|---|---|---|---|
| Chemistry Type | ||||
| Epoxy |  | |||
| Silicone | ||||
| Polyurethane | ||||
| Colour | ||||
| Amber |  | |||
| Colourless | ||||
| Black | ||||
| White | ||||
| Grey | ||||
| Off White | ||||
| Red | ||||
| Hazy | ||||
| Flame Retardancy | ||||
| Yes | ||||
| No |  | |||
| Hardness | ||||
| A12 | ||||
| A20 | ||||
| A40 | ||||
| A45 | ||||
| A50 | ||||
| A55 | ||||
| A60 | ||||
| A75 | ||||
| A80 | ||||
| A85 | ||||
| D45 - 60 | ||||
| D50 | ||||
| D55 / A90 | ||||
| D57 | ||||
| D70 | ||||
| D75 | ||||
| D80 |  | |||
| D85 | ||||
| D90 | ||||
| D93 | ||||
| Density (g/mL) | ||||
| Density (g/mL) | 1.05 | |||
| Project Temperature (°C) | ||||
| Min Temperature | -40 | |||
| Max Temperature | 140 | |||
| Thermal Conductivity (W/m.K) | ||||
| Thermal Conductivity (W/m.K) | 0.20 | |||
| Mix Ratio (Volume ±5%) :1 | ||||
| Mix Ratio (Volume ±5%) :1 | 0.85 | |||
| Dielectric Strength (kV/mm) | ||||
| Dielectric Strength (kV/mm) | 12 | |||
| Dielectric Constant | ||||
| Dielectric Constant | 4.50 | |||
| Mixed System Viscosity | ||||
| Mixed System Viscosity | 12000 | |||
| Application Type | ||||
| General purpose | ||||
| Adhesive |  | |||
| Cable Jointing | ||||
| Marine | ||||
| Optical | ||||
| LED | ||||
| RF | ||||
| Chemical Resistance | ||||
| Thermally Conductive | ||||
| Soft | ||||
| Single Part | ||||
| Low Viscosity | ||||
 
                 
                 
                 
                 
                 
                 
                